The Winning Bid: UNISOC takes the tender for China Unicom’s Chips

SHANGHAI, Sep 5, 2020 – (ACN Newswire) – Results of the week's much-anticipated China Unicom Cat.1 large-scale tender have been released, with UNISOC winning the bid. According to published information, the procurement of 5 million Cat.1 sets was one of the largest among carriers to date. China Unicom's procurement will have a positive impact on the entire Internet of Things industry, and will promote rapid Cat.1 development. The successful bid for this project once again confirmed UNISOC's leadership in the Cat.1 field.





With large-scale construction of 5G networks, decommissioning processes for 2G/3G networks, policy level migration to NB-IoT/4G (including Cat.1)/5G networks with cellular IoT services, Cat.1 is poised for large-scale growth as the main driver in medium-term scenarios. UNISOC saw the development trend of IoT at an early stage, leading the industry with Cat.1 investment and application, and launching Chunto 8910DM, the world's first Cat.1bis chipset now widely used in the sharing economy, financial payment, public network intercom, energy, industrial control and other fields. Currently, there are dozens modules and other products equipped with Chunto 8910DM chipsets on the market, applied to wide-ranging fields and scenarios.

UNISOC and China Unicom will continue to cooperate on Cat.1 for the Internet of Things. By integrating their resources to advantage, the two will promote the large-scale application of Cat.1 across the industry as they build out industrial chip-network-platform solutions in future. Expect to see hardware (chips, modules, PCBA, etc.) equipped with UNISOC chips combined with Unicom's 4G/5G cellular network capabilities, as well as platform capabilities such as a connectivity management platform (CMP) and device management platform (DMP), providing industry customers with one-stop IoT solutions that meet their needs and facilitate the rapid development of the IoT.

Media Contact
UNISOC Technologies Co., Ltd
Miranda Wu – UNISOC PR Team
E-mail: mengran.wu@unisoc.com
Website: http://www.unisoc.com


Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com

5G Dark Horse — UNISOC Breaks the Siege

SHANGHAI, Aug 28, 2020 – (ACN Newswire) – In June, Counterpoint Research released "Cellular Technology Transitions and Potential for SoC Players". The report puts forward that the 5G wave is an inevitable trend and the global baseband market sales will exceed $38.7 billion by 2024. The global handset baseband manufacturers have a unique advantages in the future 5G network transition process.







According to the report, 5G handset shipments are expected to reach 1.16 billion units in 2024, with a CAGR of 137%, accounting for 70% of total handset shipments. From the perspective of chip suppliers, 5G chips are more complex and with higher threshold. At present, independent chip suppliers are still dominated by Qualcomm, MediaTek and UNISOC.

The research points out that Qualcomm is offering an end-to-end portfolio from SoC, modem, complete RF Front End (RFFE) to antenna supporting both sub-6GHz to mmWave. This portfolio is ahead of its competitors from a feature-set to a commercial availability perspective. It has captured more than half of the 5G market share. MediaTek is also ramping up its Dimensity 5G series.

And another chip supplier, UNISOC announced its first 2G/3G/4G/5G multi-mode modem V510 at MWC 2019. The 3GPP Rel.15 compliant 5G modem supports both standalone (SA) and non-standalone (NSA) networks, as well as 5G VoNR in SA mode, fitting well into the different stages of 5G development. Together with Hisense, UNISOC successfully commercialized its first generation 5G platform, with the UNISOC V510 powering the Hisense F50 smartphone.

Last November, UNISOC V510 modem was awarded the 2019 World Electronics Achievement Award, helping UNISOC further establish a solid foundation as a leading 5G solution provider.

In February this year, UNISOC unveiled its next-gen 5G SoC platform – the T7520. Utilizing a more advanced 6nm EUV process, which has 18% higher transistor density and 8% lower power consumption versus current 7nm processes, the T7520 offers compelling performance package with improved power consumption.

Its optimized multi-core design incorporates four Cortex-A76 and four Cortex-A55, a Mali-G57 based GPU, an upgraded NPU, as well as enhanced multimedia processing units to enable capabilities of 100MP and multicamera processing, up to 120Hz refresh rate and multi-screen displays.

The T7520 also showed significant improvement in terms of 5G experience, with the support of 5G NR TDD+FDD carrier aggregation, LTE and NR spectrum dynamic sharing, and uplink and downlink decoupling. Importantly, with its innovative 5G super uplink technology, the T7520 can enhance coverage by more than 100%, increase uplink speeds by up to 60% and improve peak downlink speeds to more than 3.25Gbps under SA mode. All of these advanced features make the T7520 highly competitive with mainstream platforms targeting high-spec smartphones.

In addition, Counterpoint also points out in the report that 5G not only sets off a wave of smartphone upgrading, but also brings great opportunities in some segments that are easily ignored by the industry. For details of the report, please refer to the Counterpoint website. Chinese and English versions are available for download at https://tinyurl.com/y5rnrnzl. (https://www.counterpointresearch.com/cellular-technology-transitions-potential-soc-players/)

Media Contact:
UNISOC Technologies Co., Ltd
Miranda Wu – UNISOC PR Team
E-mail: mengran.wu@unisoc.com
Website: http://www.unisoc.com


Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com

Hua Hong Semiconductor Launches 90nm Ultra-Low-Leakage Embedded Flash Process Platform to Power High-Capacity MCU Solutions

HONG KONG, Aug 27, 2020 – (ACN Newswire) – Hua Hong Semiconductor Limited (1347.HK), a global, leading specialty pure-play foundry, announced today that it has launched a 90nm ultra-low-leakage (ULL) embedded flash (eFlash) and electrically erasable programmable read-only memory (EEPROM) process platform to meet the needs of large-capacity microcontroller unit (MCU). As a continuation of Hua Hong Semiconductor's 0.11um ultra-low-leakage technology, the process platform provides customers with competitive differentiated and cost-effective solution with lower power consumption, suitable for applications in Internet of Things (IoT), wearables, industrial and automotive electronics, etc.

For the newly launched 90nm ULL eFlash process platform, the leakage of 1.5V core N-Type and P-Type MOS transistors reaches 0.2pA/um, effectively extending the standby time of MCU devices. The eNVM (Embedded Non-Volatile Memory) IP of this platform has unique advantages such as 100,000 to 500,000 endurance cycles and read speed reaching 30ns. The platform also features highly integrated logic which exceeds 400K gate/mm2, capable of helping customers to reduce the chip area in many ways.

The most important advantage of this process platform is the integration of the Company's proprietary split gate NORD eFlash technology. It has the smallest cell size and smallest area embedded NOR flash IP under the 90nm process within the industry, also advantage with fewer layers of mask which helping customers to further reduce the manufacturing cost of MCU, especially large-capacity MCU products. The platform supports RF, eFlash and EEPROM.

Executive Vice President of Hua Hong Semiconductor Dr. Kong Weiran remarked, "The Company is committed to innovation and continuous optimization of differentiated technologies to provide customers with urgently needed, cost-effective process and technical services. While improving the 8-inch platform, it is speeding up the capacity expansion and technology R&D of the 12-inch production line. IoT and automotive electronics are incremental markets for MCU applications. The launch of the 90nm ultra-low-leakage eFlash technology platform further makes available more foundry options for Hua Hong Semiconductor's MCU customers in ultra-low power consumption applications."

About Hua Hong Semiconductor
Hua Hong Semiconductor Limited (1347.HK) is a global, leading pure-play foundry with specialty process platforms uniquely focused on embedded non-volatile memory (eNVM), power discrete, analog & power management, and logic & RF. Of special note is the Company's outstanding quality control system that satisfies the strict requirements of automotive chip manufacturing. The Company is part of the Huahong Group, an enterprise group whose main business is IC manufacturing, with advanced "8+12" production line technology.

The Company presently operates three 8-inch wafer fabrication facilities within the Huahong Group (HH Fab1, HH Fab2, and HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a total monthly 8-inch wafer capacity of approximately 180,000 wafers. The Company also operates a 12-inch wafer fabrication facility (HH Fab7) with the planned monthly capacity of forty thousand 12-inch wafers in Wuxi's National High-Tech Industrial Development Zone. Formal incorporation of and start of operations at HH Fab7 were achieved in 2019. In the Chinese mainland, it has become a leading 12-inch semiconductor production line devoted to specialty processes and is the first 12-inch foundry devoted to power discrete semiconductors.

For more information, please visit: www.huahonggrace.com


Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com

Mitsubishi Licenses Hybrid Technology Patents from Paice, Abell Foundation

BALTIMORE, MD / ACCESSWIRE, Aug 25, 2020 – (ACN Newswire) – Paice, a pioneer in hybrid electric vehicle technology, announced today that it has reached an agreement to license its patented hybrid technology to MITSUBISHI MOTORS CORPORATION, a global leader in plug-in hybrid vehicles. The Mitsubishi Outlander is the world's best-selling plug-in hybrid.

"Mitsubishi is one of the most successful hybrid vehicle companies in Europe, and we are pleased to be adding them to the long list of leading automakers who have recognized the value of Paice's hybrid technology," said Paice Executive Chairman Frances Keenan. "We continue to reach meaningful agreements with responsible car companies without the need for litigation, expanding the reach of our technology and supporting the good works of the Abell Foundation."

Paice was an early leader in electrified vehicles. The company was awarded its first hybrid vehicle patent in 1994, long before most automakers began seriously focusing on ways to improve fuel efficiency and reduce emissions. Paice's technology proved valuable and helped accelerate the growth of the hybrid vehicle industry. An independent analysis concluded that Paice owns the most dominant hybrid vehicle patents in the world.

During the company's early years, Dr. Alex Severinsky, inventor and founder of Paice, worked closely with two experienced automotive veterans: Bob Templin, a Paice board member who had served as chief engineer of Cadillac and technical director of GM's Research Laboratory; and Ted Louckes, a 40-year veteran of General Motors who served as Paice's Chief Operating Officer and was instrumental in developing Paice's hybrid technology alongside Dr. Severinsky.

About Paice (www.paicehybrid.com)

Dr. Alex Severinsky, a Russian immigrant, founded Paice in 1992 with the support of the University of Maryland. The company has been awarded 30 U.S. and foreign patents. It has licensing agreements with many of the world's leading automakers.

About the Abell Foundation (www.abell.org)

The Abell Foundation, a Baltimore-based charitable organization dedicated to fighting urban poverty and promoting social objectives by investing in progressive local start-ups, is a co-owner of the Paice patents. Since 1999, Abell has helped support Paice's efforts to develop and promote its hybrid technology.

For More Information
Joyce Fitzpatrick | joyce@fitzpatrickcomm.com | (919) 247-4400

SOURCE: Paice


Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com

TANAKA Selected in Ministry of Economy, Trade, and Industry’s 2020 Global Niche Top Companies

TOKYO, Aug 5, 2020 – (ACN Newswire) – TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) announced today that TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, has been selected and awarded by Japan's Ministry of Economy, Trade, and Industry (METI) as one of its "Global Niche Top Companies Selection 100" (GNT Companies Selection 100) and has just received the certification.



Global Niche Top Companies Selection 100 certificate


Fuel cell catalysts



Companies selected in the GNT Companies Selection 100 are being recognized by METI for excelling in niche sectors of global markets or for being outstanding companies with businesses focused on parts or materials with increasing importance for supply chain in a changing international landscape. On June 30, 2020, METI announced the selection of 113 companies for its 2020 GNT Companies Selection 100. TANAKA Kikinzoku Kogyo was recognized and awarded a certificate in the materials and chemistry category for its catalyst products for fuel cells.

Development and Manufacture of Fuel Cell Catalysts by TANAKA Kikinzoku Kogyo

Electrode catalysts for fuel cells are materials that promote chemical reactions within fuel cells to turn hydrogen into water and electricity. Vehicles equipped with fuel cells (FCVs) are much more energy-efficient than vehicles that use energy from the combustion of gasoline or other fuels. Because there are no greenhouse gases (GHGs), such as carbon dioxide, emitted during use, FCVs are expected to provide benefits from the perspective of environmental conservation in particular. As a comprehensive manufacturer of precious metals, TANAKA Kikinzoku Kogyo was an early developer of electrode catalysts that use platinum, with the belief that they can make a significant contribution to the fuel cell industry.

TANAKA Kikinzoku Kogyo specializes in customization to meet the needs of its customers. In collaboration with industry and academia, it has also maintained, for about 15 years, the leading share of the global market for electrode catalysts for polymer electrolyte membrane fuel cells (PEFCs). In 2019, it expanded capacity at its FC Catalyst Development Center and enhanced production capabilities. As a result, it has built a system that will rapidly respond with stable supplies to increases in demand for electrode catalysts as the fuel cell market grows.

With the use of fuel cells becoming more widespread, demand for cost reductions and improved quality are also increasing, so TANAKA Kikinzoku Kogyo is continuing to develop related technologies, including the development of manufacturing processes and analysis technologies. Going forward, the company will continue to develop catalysts that improve the performance of fuel cells and reduce the use of precious metals in order to deliver products that contribute to a hydrogen society and help conserve the environment.

Reference: METI press release for the 2020 Global Niche Top Companies Selection 100
https://www.meti.go.jp/press/2020/06/20200630002/20200630002.html

TANAKA Holdings Co., Ltd. (Holding company of TANAKA Precious Metals)
Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Koichiro Tanaka, Representative Director & CEO
Founded: 1885
Incorporated: 1918*
Capital: 500 million yen
Employees in consolidated group: 5,138 (FY2019)
Employees: 221 (March 31, 2020)
Net sales of consolidated group: JPY 1,149,604 million (FY2019)
Main businesses of the group: The holding company at the center of TANAKA Precious Metals responsible for strategic and efficient group management and management guidance to group companies.
URL: https://www.tanaka.co.jp/english/
* TANAKA Holdings adopted a holding company structure on April 1, 2010.

TANAKA Kikinzoku Kogyo K.K.
Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Koichiro Tanaka, Representative Director & CEO
Founded: 1885
Incorporated: 1918
Capital: 500 million yen
Employees: 2,393 (including overseas subsidiaries) (as of March 31, 2020)
Sales: JPY 992,679,879,000 (FY2019)
Main businesses: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products.
URL: https://tanaka-preciousmetals.com

About TANAKA Precious Metals
Since its foundation in 1885, TANAKA Precious Metals has built a diversified range of business activities focused on precious metals. TANAKA is a leader in Japan regarding the volumes of precious metals handled. Over the course of many years, TANAKA has not only manufactured and sold precious metal products for industry but also provided precious metals in such forms as jewelry and resources. As precious metals specialists, all Group companies within and outside Japan work together with unified cooperation between manufacturing, sales, and technological aspects to offer products and services. Additionally, to make further progress in globalization, TANAKA Kikinzoku Kogyo welcomed Metalor Technologies International SA as a member of the Group in 2016.

As precious metal professionals, TANAKA Precious Metals will continue to contribute to the development of an enriching and prosperous society.

The five core companies that make up TANAKA Precious Metals are as follows.
— TANAKA Holdings Co., Ltd. (pure holding company)
— TANAKA Kikinzoku Kogyo K.K.
— TANAKA Denshi Kogyo K.K.
— Electroplating Engineers Of Japan, Limited
— TANAKA Kikinzoku Jewerly K.K.

Press release in PDF: http://www.acnnewswire.com/clientreports/598/200805_EN.pdf

Press Inquiries
TANAKA Holdings Co., Ltd.
https://tanaka-preciousmetals.com/en/inquiries-for-media/

Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com

Hua Hong Semiconductor Relies on “8-inch + 12-inch” Strategy to Accelerate Development in IGBT Market

HONG KONG, Jul 31, 2020 – (ACN Newswire) – Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", stock code: 1347.HK), a global, leading specialty pure-play foundry, announced that it will fully cooperate with IGBT (Insulated Gate Bipolar Transistor) product customers to shape the IGBT ecosystem. So far, the IGBT chips with market competitiveness manufactured by the Company have been rapidly introduced into the markets of new energy vehicles, wind power generation, white smart home appliances, etc., further enriching the IGBT product line and offering a new business growth opportunity to the Company.

IGBT is the core device of energy conversion and transmission, known as "CPU of Power Electronics Industry". As the concepts of Internet of Things (IoT) and low carbon are becoming increasingly popular, the demand for green energy and smart, variable frequency home appliances has become unstoppable and will continue to spur the rapid growth of IGBT market.

As the world's first 8-inch foundry to provide technology for volume production of Field Stop (FS) IGBT, Hua Hong Semiconductor has profound experience in IGBT manufacturing, and has already reached the world-leading level in terms of turn-on voltage drop, turn-off loss, work safety zone and reliability. The Company has the advanced full set of IGBT thin wafer BGBM (Backside Grinding / Backside Metallization) processing technology. Hua Hong Semiconductor offers a wide range of mass-produced IGBTs, with voltages ranging from 600V to 1,700V and currents ranging from 10A to 400A, and has expanded its product portfolio from consumer products to industrial/commercial uses, new energy vehicles, etc. In addition to efforts towards higher power density and lower power loss required for high-voltage power devices, the Company is developing intelligent IGBT technology with on-chip sensors and highly reliable IGBT technology with a new thermal dissipation feature to better serve the growing demand for IGBT products in the global market.

Executive Vice President of Hua Hong Semiconductor Mr. Fan Heng remarked, "Hua Hong Semiconductor has the first 12-inch foundry devoted to power discrete semiconductors in the Chinese mainland and relies on the "8-inch +12-inch" strategy to offer a wider range of differentiated technologies and more adequate capacity. In recent years, the Company has been aiming at medium- and high-end markets and emerging fields to fully develop IGBT business, and has continuously engaged first-class IGBT product companies at home and abroad to cover application fields such as industry, automotive electronics and white goods, so as to secure its leading position in IGBT foundry. As its IGBT technology R&D is progressing well at 12-inch production line, the Company is expected to provide more competitive IGBT foundry solutions for global customers in the future."

About Hua Hong Semiconductor
Hua Hong Semiconductor Limited ("Hua Hong Semiconductor", stock code: 1347.HK) (the "Company") is a global, leading pure-play foundry with specialty process platforms uniquely focused on embedded non-volatile memory ("eNVM"), power discrete, analog & power management, and logic & RF. Of special note is the Company's outstanding quality control system that satisfies the strict requirements of automotive chip manufacturing. The Company is part of the Huahong Group, an enterprise group whose main business is IC manufacturing, with advanced "8+12" production line technology.

The Company presently operates three 8-inch wafer fabrication facilities within the Huahong Group (HH Fab1, HH Fab2, and HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a total monthly 8-inch wafer capacity of approximately 180,000 wafers. The Company also operates a 12-inch wafer fabrication facility (HH Fab7) with the planned monthly capacity of forty thousand 12-inch wafers in Wuxi's National High-Tech Industrial Development Zone. Formal incorporation of and start of operations at HH Fab7 were achieved in 2019. In the Chinese mainland, it has become a leading 12-inch semiconductor production line devoted to specialty processes and is the first 12-inch foundry devoted to power discrete semiconductors.

For more information, please visit: www.huahonggrace.com



Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com

Furuya Metal Has Become the First Japanese Precious Metal Company to Establish a Joint Venture with Anglo Platinum Marketing Limited, a Major PGM Producer in South Africa

TOKYO, Jul 27, 2020 – (ACN Newswire) – Furuya Metal Co., Ltd. (Head office: Toshima-ku, Tokyo; President: Takahito Furuya) has established a new company named "Furuya Eco-Front Technology" on May 27 2020, which will handle environmental businesses that capitalize on low-temperature active catalysts (hereafter referred to as "FT-eco catalysts"), and that on July 1 it signed an agreement to form a joint venture with Anglo Platinum Marketing Limited (Head office: London, the United Kingdom, hereafter referred to as "APML"), a subsidiary of Anglo American Plc. APML, which appreciates Furuya Metal's environmental businesses, is providing 40% of the capital for the new joint venture. This is the first time a major mining company in South Africa where accounts for 70% of the global platinum production, has formed a joint venture with a Japanese precious metal company.

In 2017, Furuya Metal established a mass-production system for FT-eco catalysts that resolves volatile organic compounds (VOCs), which are harmful to humans and cause allergies and offensive odors, as well as ethylene, which accelerates the decay of plants, and has been actively promoting these catalysts.

As urban areas have developed economically in China and Southeast Asian countries, as well as Japan, people are continuously flowing into these areas, which creates food safety issues and increases the need for reducing food waste and improving public hygiene. In order to reduce the food waste due to spoilage and to improve people's health by preventing odor, inhibiting molds, and taking the advantage of the antimicrobial effect, Furuya Metal has recently established a new company. Furuya Metal is aiming to consolidate its business resource related to FT-eco catalyst, expand its distribution channels further, including overseas markets, and promote technology development through a newly formed subsidiary.

Press release (PDF): http://www.acnnewswire.com/clientreports/598/202007.pdf

About FT-eco catalysts

FT-eco catalysts are catalysts in which nanoparticles of precious metals such as platinum are carried in a special ceramic carrier. These catalysts can efficiently resolves VOCs and ethylene within a temperature range between 0 degrees and 30 degrees Celsius (room temperature) and exhibit a high level of catalytic effect when simply placed within the target space. Furthermore, since they almost never need to be replaced, cost reduction and energy saving can be expected. Therefore, it is projected that these catalysts will be utilized by makers of home appliances, such as air cleaners and refrigerators, retails stores that need to maintain the freshness of fruits, vegetables, flowers, and plants, and in logistics applications such as cold chains.

FT-eco catalysts are next-generation, energy-saving, environment-friendly catalysts that, because they work at low temperatures, can be expected to reduce energy consumption, thereby reducing CO2 emissions, and that have the potential of contributing to food waste reduction by maintaining freshness.

Furuya Metal Group specializes in PGM with particularly excellent properties among precious metals, and develops and manufactures products for a wide range of fields, including electronics, optical glass, clean energy, precious metal resource reutilization, environment, and medicine. The company was selected as one of the Global Niche Top Companies Selection 100 by Japan's Ministry of Economy, Trade and Industry (METI) in the program's first year (2014) and again in its second year (2020). We plans to continue capitalizing on its unique technologies to help resolve social issues.

Overview of the new company
– Company name: Furuya Eco-Front Technology Co., Ltd.
– Head office location: MSB-21 Minami Otsuka Bldg., 2-37-5 Minami Otsuka, Toshima-ku, Tokyo
– President: Hideki Kuwabara (Furuya Metal Co., Ltd. director), Wei Chen
– Established: May 27, 2020
– Capital: 250 million yen
– Capital ratio: Furuya Metal Co., Ltd. 60%; Anglo Platinum Marketing Ltd. 40%
– Business description: Development, manufacture, sales, and export of freshness-maintaining, mold-inhibiting, and antimicrobial environmental products that utilize low-temperature active catalysts

Product description video: https://www.youtube.com/channel/UCGZa2eorg4ts1FHxxOOGvPg

[Overview of Furuya Metal Co., Ltd.]

Furuya Metal manufactures industrial-use precious metal products utilizing precious metals with high scarcity value included among platinum group metals (PGM) such as platinum (Pt), iridium (Ir) and ruthenium (Ru). Due to the extreme difficulty in processing these precious metals, the number of industrial-use precious metal manufacturers specializing in PGM is limited, even on a worldwide level. Industrial-use precious metals centered on PGM, can be considered as materials with a vital role in supporting advancements in the fields of electronics, optical glass, clean energy, environment and medicine because of their excellent characteristics such as heat resistance, chemical stability and good electrical conductivity.

The Company specializes in PGM possessing particularly excellent properties among precious metals, and manufactures and sells industrial-use precious metal products such as crucibles (heat-resistant containers), thin film materials, thermocouples (thermometers), and compounds, and is also engaged in recycling businesses, such as refining and recovering rare precious metals in order to most effectively utilize them.

Headquarters: MSB-21 Minami Otsuka Bldg., 2-37-5 Minami Otsuka, Toshima-ku, Tokyo
Representative: Takahito Furuya, President
Founded: March 1951
Incorporated: August 22, 1968
Capital: 5,445 million yen
Listed exchange: JASDAQ Standard (Securities code: 7826)
Employees: 312 (as of June 30, 2019)
Sales: 21,163 million yen (as of June 30, 2019)
Business description: Manufacture and sales of industrial-use precious metal products such as iridium and platinum, and thermosensors. Sales of electronic materials and semiconductor-related products. Manufacture and sales of thin film components.
Website: http://www.furuyametals.co.jp/

Press inquiries
Furuya Metal Co., Ltd. Planning Group of Metal Business Office
Naonori Odaka
E-Mail: odaka@furuyametals.co.jp

Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com

Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform

HONG KONG, Jul 20, 2020 – (ACN Newswire) – Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", stock code: 1347.HK), a global, leading specialty pure-play foundry, announced that its 95nm SONOS (Silicon Oxide Nitride Oxide Silicon) embedded non-volatile memory (eNVM) process platform has further enhanced its technological advantages and greatly improved its reliability through continuous innovation and upgrading.

Hua Hong Semiconductor's 95nm SONOS eNVM process technology is widely used in Microcontroller Unit (MCU), Internet of Things (IoT) and other fields, and offers good stability, high reliability and low power consumption. Compared with the previous generation of technologies, the 95nm SONOS eNVM 5V process has achieved smaller design rules, smaller chip area of similar products; the chip gate density of the logic part has increased by 40%+ compared with existing similar processes in the industry, reaching the industry leading level; fewer mask layers are required, thence to provide a more cost-effective solution. Also, the 95nm SONOS eNVM 5V process offers higher integration and leading device performance, with advanced memory medium erase/program characteristics up to 2 milliseconds, 20% improved drive capability for low-power devices, and coverage of wide voltage applications ranging from 1.7V to 5.5V with only 5V devices.

Hua Hong Semiconductor continues to strive for better performance. Its 95nm SONOS eNVM adopts a new memory structure and optimizes the operating voltage, greatly increasing the threshold voltage window. Under the same test conditions, the erase/program capacity of SONOS IP reaches 10 million times, and the reliability is improved by 20 times; at 85 degree celsius , the data retention capacity can be up to 30 years, reaching the international leading level. Hua Hong Semiconductor is committed to continuously optimizing the process level to improve IP endurance and data retention, to better meet the market demand for ultra-high reliability products.

In addition, with the increasing popularity of highly reliable process platforms and derivative processes, the Company's eNVM based on the SONOS process can cover MTP (Multi-Time Programmable Memory) applications. By simplifying the design, optimizing the IP area and reducing the test time, in terms of IP area, test time and power consumption, with the erase and program capacity has a better performance than MTP. On this basis, additional optional devices are added to further meet the needs of power management and RF products.

Executive Vice President of Hua Hong Semiconductor Dr. Kong Weiran remarked, "eNVM technology has always been one of Hua Hong Semiconductor's key advantages, maintaining a leading position in the industry and providing a flexible and diverse technology platform for MCU customers. Under the guidance of the '8-inch + 12-inch' strategy, Hua Hong Semiconductor will further enhance the embedded flash memory technology on the 8-inch platform by developing a smaller memory cell IP size and lower mask-count; and we have also relied on the narrower linewidth capability of the 12-inch platform to build a high-performance eNVM technology platform and meet the needs of high-growth markets such as IoT, MCU and automotive electronics while consolidating its position as a leader in smart card chip manufacturing."

About Hua Hong Semiconductor
Hua Hong Semiconductor Limited ("Hua Hong Semiconductor", stock code: 1347.HK) ("the Company") is a global, leading pure-play foundry with specialty process platforms uniquely focused on embedded non-volatile memory ("eNVM"), power discrete, analog & power management, and logic & RF. Of special note is the Company's outstanding quality control system that satisfies the strict requirements of automotive chip manufacturing. The Company is part of the Huahong Group, an enterprise group whose main business is IC manufacturing, with advanced "8+12" production line technology.

The Company presently operates three 8-inch wafer fabrication facilities within the Huahong Group (HH Fab1, HH Fab2, and HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a total monthly 8-inch wafer capacity of approximately 180,000 wafers. The Company also operates a 12-inch wafer fabrication facility (HH Fab7) with the planned monthly capacity of forty thousand 12-inch wafers in Wuxi's National High-Tech Industrial Development Zone. Formal incorporation of and start of operations at HH Fab7 were achieved in 2019. In the Chinese mainland, it has become a leading 12-inch semiconductor production line devoted to specialty processes and is the first 12-inch foundry devoted to power discrete semiconductors.

For more information, please visit: www.huahonggrace.com


Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com

UNISOC 4G Watch Platform W307 Is Newly Upgraded

HONG KONG, Jul 15, 2020 – (ACN Newswire) – UNISOC, the world's leading supplier of core chips for mobile communications and the Internet of Things, launched its new smartwatch platform UNISOC W307. Based on ultra-low-power architecture design, it adopts the high-precision positioning scheme and highly integrated 4G full-network, which will bring users a richer intelligent experience.





The W307 is made using TSMC's 28nm HPC+, with a chip integrated with CPU, memory, 4G multi-mode modem, Bluetooth, Wi-Fi, GNSS, and image system. W307 package area is smaller than the previous generation UNISOC 8521E, which brings more freedom for the design of terminal products. W307 significantly optimizes performance, connectivity, intelligence, and power consumption. Highlights of the platform include:

– High integration: W307 SoC adopts a single-core A53 processor, and the packaging area is reduced by 30% compared with the previous generation, which greatly saves the PCB layout area and can be used as a single-side ornament.

– Light system and low power consumption: W307 adopts RTOS lightweight system and has a smooth and responsive user experience. The overall power consumption is more than 30% lower than the previous generation, which can bring more lasting performance for smartwatches.

– HD video calling: The W307 adopts UNISOC's reliable, globally certified second-generation 4G LTE multi-mode modem. It supports LTE Cat-4, WCDMA, and GSM communication standards, providing 4G + Wi-Fi HD video calling.

– Sub-meter high precision positioning: Combined with the AI multiple positioning technologies and high-precision positioning SDK of UNISOC, W307 can support sub-meter high precision positioning, and provide a strong technical foundation for the electronic fence and other application scenarios. It meets the needs of parents to obtain accurate positions of children.

– Rich applications: W307 can be adapted to a variety of RTOS applications. It supports the nine-axis sensor and popular voice assistant, voice micro chat, pedometer, and other applications, which provides the rich and interesting interactive and entertainment experience for children.

As the demand for the watch market shifts from 2G to 4G and continues to grow rapidly, UNISOC takes a leading position in the field of 4G children's watches by its innovative advantages and has established long-term cooperation with the mainstream smartwatch brands in the industry. The release of platform UNISOC W307 further enriched the platform portfolio for smartwatches.

Media Contact:
UNISOC Technologies Co., Ltd
Miranda Wu – UNISOC PR Team
E-mail: mengran.wu@unisoc.com
Website: http://www.unisoc.com


Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com

UNISOC Completes Equity Restructuring, Promotes IPO Process

SHANGHAI, Jul 13, 2020 – (ACN Newswire) – As announced on May 12, Chinese fabless semiconductor company UNISOC increased capital by CNY 5 billion (USD 715 million) to complete its equity restructuring. The IPO process is now on track for a 2021 listing on the SSE STAR Market, Shanghai's recent NASDAQ-style Science and Technology board, by the restructured company valued at CNY 55 billion (USD 7.86 billion).

Based on Shanghai Stock Exchange (SSE) announcements, UNISOC completed the relevant registration on June 8 including the formalities of a capital increase of CNY 4.2 billion (USD 600 million) to CNY 4.62 billion (USD 660 million) and the substantially altered equity structure. The listing entity will be UNISOC Communications (Shanghai) Technology Co., Ltd.

UNISOC shareholders have increased from 7 to 31, including 17 investment funds (limited partnerships) accounting for 70% of new shareholdings. Beijing Spreadtrum Investment remains the largest shareholder with 38.55% (57.14% pre-restructuring), followed by China National IC Industry Investment Fund (CICIIF or 'Big Fund') with 15.27%, and Intel (China) with 12.98%. Shanghai IC Industry Investment Fund and China National Fund II follow jointly in fourth, with each holding 4.09%.

"This equity reorganization is conducive to optimizing equity structure and enhancing financial strength," said UNISOC previously. "The capital increase will be used for R&D in advanced technologies for 5G, IoT, AI and other fields, which will further strengthen technological competitiveness, and promote UNISOC's stable long-term development."


Copyright 2020 ACN Newswire. All rights reserved. http://www.acnnewswire.com